The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jul. 11, 2007
Akira Muto, Tokyo, JP;
Ichio Shimizu, Tokyo, JP;
Tetsuo Iljima, Tokyo, JP;
Toshiyuki Hata, Tokyo, JP;
Katsuo Ishizaka, Tokyo, JP;
Akira Muto, Tokyo, JP;
Ichio Shimizu, Tokyo, JP;
Tetsuo Iljima, Tokyo, JP;
Toshiyuki Hata, Tokyo, JP;
Katsuo Ishizaka, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
A semiconductor device is provided, which is capable of improving mounting flexibility relatively and increasing general versatility, as well as realizing heat radiation characteristics and low on-resistance. Moreover, the semiconductor device is provided, which is capable of improving reliability, performing processing in manufacturing processes easily and reducing manufacturing costs. Also, the semiconductor device capable of decreasing the mounting area is provided. A semiconductor chip in which an IGBT is formed and a semiconductor chip in which a diode is formed are mounted over a die pad. Then, the semiconductor chip and the semiconductor chip are connected by using a clip. The clip is arranged so as not to overlap with bonding pads formed at the semiconductor chip in a flat state. The bonding pads formed at the semiconductor chip are connected to electrodes by using wires.