The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2012
Filed:
May. 25, 2007
Applicant:
Chris Wyland, Livermore, CA (US);
Inventor:
Chris Wyland, Livermore, CA (US);
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 12/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture. The mixture is used to create the composite bond wire. A composite wire having an inner core and an outer layer having a higher conductivity than the inner core is also provided. The outer layer is designed to be thicker than the skin depth at the operating frequency for carrying AC signals.