The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2012
Filed:
Nov. 04, 2009
Joon-sang Park, Seoul, KR;
Chung-ki Min, Yongin-si, KR;
Dong-keun Kim, Hwaseong-si, KR;
Yeol Jon, Yongin-si, KR;
Chang-sun Hwang, Daejeon, KR;
Tae-eun Kim, Suwon-si, KR;
Joon-sang Park, Seoul, KR;
Chung-ki Min, Yongin-si, KR;
Dong-keun Kim, Hwaseong-si, KR;
Yeol Jon, Yongin-si, KR;
Chang-sun Hwang, Daejeon, KR;
Tae-eun Kim, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A chemical-mechanical polishing (CMP) method of polishing a phase-change material and a method of fabricating a phase-change memory, the CMP method including forming the phase-change material on an activation surface of a semiconductor wafer, and performing a CMP process on the phase-change material using a polishing pad, wherein the performing the CMP process includes reducing a change in the composition of the phase-change material by adjusting, within a predetermined range, a temperature of a region where the semiconductor wafer and the polishing pad contact each other.