The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
Mar. 06, 2009
Applicants:
Natsuko Ueda, Nagano, JP;
Yuji Yukiiri, Nagano, JP;
Inventors:
Natsuko Ueda, Nagano, JP;
Yuji Yukiiri, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer wiring substrate having no core substrate is provided. The multilayer wiring substrate includes: a laminated body includes: a plurality of insulating layers; and a plurality of wiring layers. The laminated body has: a mounting surface on which a semiconductor element is mounted; and a bonding surface to which external connection terminals are bonded. At least one of the insulating layers contains a glass cloth.
Ueda, Natsuko. (2012). Multilayer wiring substrate with a reinforcing layer for preventing a warp (U.S. Patent No. 8129626). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8129626
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile