The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2012

Filed:

Jul. 30, 2008
Applicants:

Yasuaki Tachi, Gifu, JP;

Shigeki Sawa, Gifu, JP;

Toshiyuki Kasuga, Gifu, JP;

Inventors:

Yasuaki Tachi, Gifu, JP;

Shigeki Sawa, Gifu, JP;

Toshiyuki Kasuga, Gifu, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-supply section provided within the interior of the plating tank, an auxiliary cathode power-supply section provided within the interior of the plating tank, and short-circuit wiring configured to short-circuit the immersed cathode power-supply section to the auxiliary cathode power-supply section. A plating method for performing electrolytic plating on a plating surface of a belt substrate is provided. The method includes conveying the belt substrate through a plating tank, making the plating surface a cathode by contacting at least one of an immersed cathode power-supply section or an auxiliary cathode power-supply section with the belt substrate, and short-circuiting the immersed cathode power-supply section to the auxiliary cathode power-supply section.


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