The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2012
Filed:
May. 18, 2010
Takuya Oda, Nagano, JP;
Takuya Oda, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
A recessed portion is formed in a predetermined position in a heat-spreading component. A thermoplastic resin serving as a thermal interface material (TIM) is stored in the recessed portion. Meanwhile, a large number of filamentous thermo-conductive elements serving as the TIM are arranged to stand side by side on a surface of the heat-spreading component in which the recessed portion is formed (or on an exposed surface of an electronic component). Then, the heat-spreading component is fixed onto a board in such a manner that the surface of the heat-spreading component in which the recessed portion is formed faces the board and that a clearance is adjusted between the electronic component and the heat-spreading component. Thereafter, the resin is heated to a softening point thereof into a fluidized state, and the resin is flowed and filled into the clearance between the electronic component and the heat-spreading component.