The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8125087 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 28, 2012

Filed:

Feb. 20, 2001
Applicant:

Mark P. Jamieson, Folsom, CA (US);

Inventor:

Mark P. Jamieson, Folsom, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnect routing for a card or interposer or the like, including splines of traces on a first layer and traces on a second layer, with vias connecting between the layers. Outer rows of signals are routed out from a chip on the first layer, while inner rows of signals are viad down to the second layer where they are routed out, then viad back up to the first layer. These outer vias are arranged in an arc, enabling the second layer trace segments to be of a more uniform length. The second layer may also include ground or power plane fingers extending between the splines and viad up to ground or power signals of the chip.


Find Patent Forward Citations

Jamieson, Mark. (2012). High-density flip-chip interconnect (U.S. Patent No. 8125087). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8125087

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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