The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2012
Filed:
Apr. 14, 2008
Seigo Kurosaka, Hirakata, JP;
Yukinori Oda, Hirakata, JP;
Akira Okada, Hirakata, JP;
Ayumi Okubo, Hirakata, JP;
Masayuki Kiso, Hirakata, JP;
Seigo Kurosaka, Hirakata, JP;
Yukinori Oda, Hirakata, JP;
Akira Okada, Hirakata, JP;
Ayumi Okubo, Hirakata, JP;
Masayuki Kiso, Hirakata, JP;
C. Uyemura & Co., Ltd., Osaka-Shi, Osaka, JP;
Abstract
Part or whole of an electroless gold plating film of a plated film laminate including an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film is formed by an electroless gold plating using an electroless gold plating bath including a water-soluble gold compound, a complexing agent, formaldehyde and/or a formaldehyde-bisulfite adduct, and an amine compound represented by the following general formula R—NH—CH—NH—Ror R—(CH—NH—CH—NH—CH)—R. The method of the invention does not need two types of baths, a flash gold plating bath and a thick gold plating bath for thickening. Gold plating films of different thicknesses suited for solder bonding or wire bonding can be formed using only one type of gold plating bath.