The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8120040 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 21, 2012

Filed:

May. 24, 2010
Applicants:

Motoo Asai, Ibi-gun, JP;

Hiroaki Kodama, Ibi-gun, JP;

Toyoaki Tanaka, Ibi-gun, JP;

Inventors:

Motoo Asai, Ibi-gun, JP;

Hiroaki Kodama, Ibi-gun, JP;

Toyoaki Tanaka, Ibi-gun, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.


Find Patent Forward Citations

Asai, Motoo. (2012). Substrate for mounting ic chip, manufacturing method of substrate for mounting ic chip, device for optical communication, and manufacturing method of device for optical communication (U.S. Patent No. 8120040). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8120040

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