The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2012

Filed:

Nov. 06, 2008
Applicants:

Akio Horiuchi, Nagano, JP;

Hiroshi Yokota, Nagano, JP;

Inventors:

Akio Horiuchi, Nagano, JP;

Hiroshi Yokota, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring boardincludes a wiring board main bodyhaving a semiconductor device attaching padon which a semiconductor deviceis attached, a dielectric layerprovided with the semiconductor device attaching pad, and a semiconductor device attaching area A in which the semiconductor deviceis attached, and a stiffener bonded to a surfaceA of the dielectric layeron the side where the semiconductor device attaching padis formed and having a semiconductor device attaching through portionA to expose the semiconductor device attaching area A, characterized in that a notch portionfor exposing the surfaceA of the dielectric layerin a part located outside the semiconductor device attaching area A is provided on the outer periphery of the stiffener


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