The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8118591 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 21, 2012

Filed:

Mar. 15, 2007
Applicants:

Terumasa Ishihara, Tokyo, JP;

Takaharu Hashimoto, Tokyo, JP;

Masayuki Mizuno, Tokyo, JP;

Masaru Morita, Tokyo, JP;

Inventors:

Terumasa Ishihara, Tokyo, JP;

Takaharu Hashimoto, Tokyo, JP;

Masayuki Mizuno, Tokyo, JP;

Masaru Morita, Tokyo, JP;

Assignee:

IHI Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27D 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate, a heaterpositioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield platehorizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plateis composed of a structural membermade of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating memberwhich covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.


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Ishihara, Terumasa. (2012). Heat shield plate for substrate annealing apparatus (U.S. Patent No. 8118591). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8118591

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