The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Jan. 16, 2009
Ronald Eisele, Surendorf, DE;
Mathias Kock, Gokels, DE;
Ronald Eisele, Surendorf, DE;
Mathias Kock, Gokels, DE;
Danfoss Silicon Power GmbH, Schleswig, DE;
Abstract
A method for the low-temperature pressure sintering of at least one electronic unit to be contacted thermally, firmly connected mechanically, and located on a substrate, comprising the following steps: pressing the electronic unit using a mold enveloping matrix while sparing a connecting surface of the substrate for a heat sink connection, providing a heat sink plate, applying a sintering connecting layer onto the spared region of the connecting surface and/or onto to the region of the heat sink plate provided for contacting, and bonding of the heat sink plate to the substrate of the electronic unit in the region of the connecting surface using silver low-temperature pressure sintering technology.