The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8111521 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 07, 2012

Filed:

Aug. 08, 2007
Applicants:

Telesphor Kamgaing, Chandler, AZ (US);

Emile Davies-venn, Phoenix, AZ (US);

Inventors:

Telesphor Kamgaing, Chandler, AZ (US);

Emile Davies-Venn, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectronic package having a radio frequency (RF) amplifier circuit and, incorporating harmonic rejection filters and matching circuits integrally formed in the package is disclosed. A harmonic rejection filter may comprise a metal-insulator-metal (MIM) capacitor serially coupled between bond pads disposed on a RF amplifier circuit die, a first wire bond coupling a first bond pad to a package output, where the first bond pad is coupled to the output of the RF amplifier, and a second wire bond coupling a second bond pad to a package ground. The harmonic rejection filter may be appropriately configured to filter one or more harmonics at different frequencies.


Find Patent Forward Citations

Kamgaing, Telesphor. (2012). Package-based filtering and matching solutions (U.S. Patent No. 8111521). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8111521

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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