The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2012

Filed:

Dec. 29, 2008
Applicants:

Hyun-soo Chung, Hwaseong-si, KR;

Dong-ho Lee, Seongnam-si, KR;

Dong-han Kim, Osan-si, KR;

Seong-deok Hwang, Seoul, KR;

Ki-hyuk Kim, Yongin-si, KR;

Inventors:

Hyun-Soo Chung, Hwaseong-si, KR;

Dong-Ho Lee, Seongnam-si, KR;

Dong-Han Kim, Osan-si, KR;

Seong-Deok Hwang, Seoul, KR;

Ki-Hyuk Kim, Yongin-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that cracks may not be generated in the outer terminals.


Find Patent Forward Citations

Chung, Hyun-Soo. (2012). Semiconductor module (U.S. Patent No. 8111520). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8111520

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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