The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Dec. 29, 2008
Applicants:
Hyun-soo Chung, Hwaseong-si, KR;
Dong-ho Lee, Seongnam-si, KR;
Dong-han Kim, Osan-si, KR;
Seong-deok Hwang, Seoul, KR;
Ki-hyuk Kim, Yongin-si, KR;
Inventors:
Hyun-Soo Chung, Hwaseong-si, KR;
Dong-Ho Lee, Seongnam-si, KR;
Dong-Han Kim, Osan-si, KR;
Seong-Deok Hwang, Seoul, KR;
Ki-Hyuk Kim, Yongin-si, KR;
Assignee:
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor module can include a printed circuit board (PCB) and a semiconductor package inserted into an inner space of the PCB. The semiconductor package may be electrically connected to the PCB. The PCB may thus surround the semiconductor package so that cracks may not be generated in the outer terminals.