The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2012

Filed:

Sep. 09, 2008
Applicants:

Jinshu Zhang, Bend, OR (US);

Dumitru Sdrulla, Bend, OR (US);

Dah Wen Tsang, Bend, OR (US);

Inventors:

Jinshu Zhang, Bend, OR (US);

Dumitru Sdrulla, Bend, OR (US);

Dah Wen Tsang, Bend, OR (US);

Assignee:

Microsemi Corporation, Bend, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/765 (2006.01);
U.S. Cl.
CPC ...
Abstract

High voltage semiconductor devices with high-voltage termination structures are constructed on lightly doped substrates. Lightly doped p-type substrates are particularly prone to depletion and inversion from positive charges, degrading the ability of associated termination structures to block high voltages. To improve the efficiency and stability of termination structures, second termination regions of the same dopant type as the substrate, more heavily doped than the substrate but more lightly doped than first termination regions, are positioned adjoining the first termination regions. The second termination regions raise the field threshold voltage where the surface is vulnerable and render the termination structure substantially insensitive to positive charges at the surface. The use of higher dopant concentration in the gap region without causing premature avalanche is facilitated by only creating second termination regions for regions lacking field plate protection.


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