The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Dec. 23, 2009
Atsuko Sakata, Yokohama, JP;
Soichi Yamashita, Kawasaki, JP;
Yasuyuki Sonoda, Tsukuba, JP;
Hiroshi Toyoda, Kamakura, JP;
Masahiko Hasunuma, Yokohama, JP;
Atsuko Sakata, Yokohama, JP;
Soichi Yamashita, Kawasaki, JP;
Yasuyuki Sonoda, Tsukuba, JP;
Hiroshi Toyoda, Kamakura, JP;
Masahiko Hasunuma, Yokohama, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
An embodiment of the present invention provides a method for manufacturing a semiconductor device. This method comprises: forming a seed film at least on an inner face of a recessed portion of a substrate; forming a protection film on the seed film, the protection film being made of a material that is more easily oxidized than a material forming the seed film; heat-treating the protection film; exposing at least part of the seed film by removing at least part of the heat-treated protection film; forming a plating film on the seed film through electrolytic plating to be buried in the recessed portion, by supplying current to the seed film that is at least partially exposed; and removing the plating film except for a portion buried in the recessed portion.