The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
May. 13, 2009
Andy Tsen, Chung-Ho, TW;
JO Fei Wang, Hsin-Chu, TW;
Po-feng Tsai, Taipei, TW;
Ming-yu Fan, Hsinchu County, TW;
Jill Wang, Hsinchu, TW;
Jong-i Mou, Hsinpu Township, Hsinchu County, TW;
Sunny Wu, Zhudong Town, TW;
Andy Tsen, Chung-Ho, TW;
Jo Fei Wang, Hsin-Chu, TW;
Po-Feng Tsai, Taipei, TW;
Ming-Yu Fan, Hsinchu County, TW;
Jill Wang, Hsinchu, TW;
Jong-I Mou, Hsinpu Township, Hsinchu County, TW;
Sunny Wu, Zhudong Town, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
System and method for implementing wafer acceptance test ('WAT') advanced process control ('APC') are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process.