The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2012
Filed:
Mar. 31, 2009
Hironobu Miya, Toyama, JP;
Kazuyuki Toyoda, Toyama, JP;
Taketoshi Sato, Toyama, JP;
Masayuki Asai, Toyama, JP;
Norikazu Mizuno, Toyama, JP;
Masanori Sakai, Tokyo, JP;
Kazuyuki Okuda, Tokyo, JP;
Hideki Horita, Toyama, JP;
Hironobu Miya, Toyama, JP;
Kazuyuki Toyoda, Toyama, JP;
Taketoshi Sato, Toyama, JP;
Masayuki Asai, Toyama, JP;
Norikazu Mizuno, Toyama, JP;
Masanori Sakai, Tokyo, JP;
Kazuyuki Okuda, Tokyo, JP;
Hideki Horita, Toyama, JP;
Hitachi Kokusai Electric Inc., Tokyo, JP;
Abstract
Disclosed is a producing method of a semiconductor device comprising a first step of supplying a first reactant to a substrate to cause a ligand-exchange reaction between a ligand of the first reactant and a ligand as a reactive site existing on a surface of the substrate, a second step of removing a surplus of the first reactant, a third step of supplying a second reactant to the substrate to cause a ligand-exchange reaction to change the ligand after the exchange in the first step into a reactive site, a fourth step of removing a surplus of the second reactant, and a fifth step of supplying a plasma-excited third reactant to the substrate to cause a ligand-exchange reaction to exchange a ligand which has not been exchange-reacted into the reactive site in the third step into the reactive site, wherein the first to fifth steps are repeated predetermined times.