The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2012

Filed:

May. 22, 2008
Applicants:

Yufang He, Guangdong, CN;

Lijun Su, Guangdong, CN;

Inventors:

Yufang He, Guangdong, CN;

Lijun Su, Guangdong, CN;

Assignees:

Iteq (Dongguan) Corporation, Guangdong, CN;

Iteq Corporation, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/04 (2006.01); C08K 3/12 (2006.01); C08K 3/14 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/36 (2006.01); C08K 3/40 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention provides a kind of prepolymer with 4-(N-maleimide phenyl)Ether (MPGE) epoxy resin and 4,4'-diphenylmethane bismaleimide (BMI) as reactants, with free radical initiator leading to reaction in solvents, and adding inhibitor after reaction, with the mole ratio of 0.05-0.5 for BMI and MPGE; the initiator usage is 0.01%-0.15% of mole total for reactant monomers; the solvent usage is 50%-70% of the total weight of the reactants; the inhibitor usage is half to double of mole amount of the initiator used. This kind of prepolymer can be used to produce high-performance thermosetting resin composition corresponding to the packaging requirements for electronic components and Integrated Circuits (IC).


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