The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Jul. 30, 2010
Chung-jen Wu, Kaohsiung, TW;
Min-chi Wang, Kaohsiung, TW;
Chung-hung Chang, Kaohsiung, TW;
Meng-yen Chou, Kaohsiung, TW;
Chin-chang Chuang, Kaohsiung, TW;
Hsin-wei Huang, Kaohsiung, TW;
Shu-wan LU, Kaohsiung, TW;
Chin-min an, Kaohsiung, TW;
Chung-hao Wu, Kaohsiung, TW;
Wen-chang Chen, Kaohsiung, TW;
Cheng-tyng Yen, Kaohsiung, TW;
Yu-wen Wang, Kaohsiung, TW;
Kuo-huang Hsieh, Kaohsiung, TW;
Chung-Jen Wu, Kaohsiung, TW;
Min-Chi Wang, Kaohsiung, TW;
Chung-Hung Chang, Kaohsiung, TW;
Meng-Yen Chou, Kaohsiung, TW;
Chin-Chang Chuang, Kaohsiung, TW;
Hsin-Wei Huang, Kaohsiung, TW;
Shu-Wan Lu, Kaohsiung, TW;
Chin-Min An, Kaohsiung, TW;
Chung-Hao Wu, Kaohsiung, TW;
Wen-Chang Chen, Kaohsiung, TW;
Cheng-Tyng Yen, Kaohsiung, TW;
Yu-Wen Wang, Kaohsiung, TW;
Kuo-Huang Hsieh, Kaohsiung, TW;
Eternal Chemical Co., Ltd, Kaohsiung, TW;
Abstract
A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R)Si(R)to allow the silica moiety to carry a photo-polymerizable unsaturated group; adding a monomer of formula RN(R)to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R, R, R, Rand x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.