The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Feb. 18, 2009
Tadato Nagasawa, Ota-Ku, JP;
Tadato Nagasawa, Ota-Ku, JP;
Disco Corporation, Tokyo, JP;
Abstract
A semiconductor chip fabrication method including a modified layer forming step of applying a laser beam having a transmission wavelength to the semiconductor wafer from the back side of the semiconductor wafer along the streets formed on the front side of the semiconductor wafer so that a focal point of the laser beam is set inside the semiconductor wafer, thereby forming a modified layer in the semiconductor wafer along each street, a metal film deposition step of depositing a metal film on the back side of the semiconductor wafer after the modified layer forming step, a semiconductor wafer attaching step of attaching the semiconductor wafer to an adhesive tape supported to an annular frame, and a semiconductor wafer dividing step of applying an external force to the semiconductor wafer in the condition where the semiconductor wafer is attached to the adhesive tape to thereby divide the semiconductor wafer with the metal film into the individual semiconductor chips along the modified layer formed along each street.