The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2012
Filed:
Apr. 01, 2008
Yasumori Fukushima, Osaka, JP;
Yutaka Takafuji, Osaka, JP;
Kazuhide Tomiyasu, Osaka, JP;
Michiko Takei, Osaka, JP;
Steven Droes, Osaka, JP;
Yasumori Fukushima, Osaka, JP;
Yutaka Takafuji, Osaka, JP;
Kazuhide Tomiyasu, Osaka, JP;
Michiko Takei, Osaka, JP;
Steven Droes, Osaka, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
A device portion forming step includes an assisting layer forming step of forming a planarization assisting layer, which covers a plurality of conductive films, over a first planarizing layer before forming a second planarizing layer. In the assisting layer forming step, the planarization assisting layer is formed so that a height of the planarization assisting layer from a surface of the first planarizing layer located on a side opposite to the substrate layer becomes equal between at least a part of a region where the conductive films are formed, and at least a part of a region where no conductive film is formed.