The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Jan. 02, 2009
Applicant:
Seiya Fujii, Tokyo, JP;
Inventor:
Seiya Fujii, Tokyo, JP;
Assignee:
Elpida Memory, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wiring board for a semiconductor device has a substrate, a solder resist provided on the substrate, a land, and a wiring line. The solder resist is not in contact with the land, and an end portion of the wiring line is arranged such that, when a solder ball is not provided, the end portion of the wiring line and the land face each other with a distance therebetween.