The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
Apr. 18, 2007
Susumu Sawada, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Takashi Kitae, Osaka, JP;
Susumu Sawada, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Seiji Karashima, Osaka, JP;
Takashi Kitae, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A connection structure (package) has a first plate bodyand a second plate body; in the first plate body, a wiring pattern having a plurality of connection terminalsis formed, and the second plate body has at least two connection terminals (electrode terminals) arranged facing the connection terminals of the first plate body. The connection terminals of the first and second plate bodies are connection terminals formed as projections on the surfaces of the first and second plate bodies. A conductive substanceis accumulated to cover at least a part of each side face of the connection terminals opposed to each other of the first and second plate bodies, and the connection terminals thus opposed are connected to each other via the conductive substance. The package thus formed is ready for a high-pin-count, narrow-pitch configuration of a next-generation semiconductor chip, and exhibits excellent productivity and reliability. The present invention is advantageous for such a package, for a connection structure applicable to the production of the package, and for a method of producing the connection structure.