The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Jun. 26, 2009
Applicants:
Kun-szu Tseng, Pingtung County, TW;
Che-hua Hsu, Hsinchu County, TW;
Cheng-wen Fan, Tainan County, TW;
Chih-yu Tseng, Hsinchu, TW;
Victor Chiang Liang, Hsinchu, TW;
Inventors:
Kun-Szu Tseng, Pingtung County, TW;
Che-Hua Hsu, Hsinchu County, TW;
Cheng-Wen Fan, Tainan County, TW;
Chih-Yu Tseng, Hsinchu, TW;
Victor Chiang Liang, Hsinchu, TW;
Assignee:
United Microelectronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/337 (2006.01); H01L 21/8234 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor structure and a method of forming the same are provided. The semiconductor structure includes a substrate, a resistor and a metal gate structure. The substrate has a first area and a second area. The resistor is disposed in the first area, wherein the resistor does not include any metal layer. The metal gate structure is disposed in the second area.