The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2012

Filed:

Aug. 11, 2009
Applicants:

Jun Su Lee, Kyunggi-do, KR;

Min Jae Lee, Seoul, KR;

Jae Dong Kim, Seoul, KR;

Jae Jin Lee, Seoul, KR;

Min Yoo, Seoul, KR;

Byung Jun Kim, Kyunggi-do, KR;

Inventors:

Jun Su Lee, Kyunggi-do, KR;

Min Jae Lee, Seoul, KR;

Jae Dong Kim, Seoul, KR;

Jae Jin Lee, Seoul, KR;

Min Yoo, Seoul, KR;

Byung Jun Kim, Kyunggi-do, KR;

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board has an insulative layer including a first surface and a second surface opposite to the first surface. A plurality of electrically conductive patterns is formed on the first surface of the insulative layer. Conductive lands are formed in a die mounting region of the first surface of the insulative layer and electrically connected to one of the plurality of conductive patterns on the first surface. An extending pattern extends from the conductive lands to outside of the mounting region. A protective layer covers the first surface of the insulative layer and the electrically conductive patterns. A trench is formed in the protective layer to expose the conductive lands and the extending patterns.


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