The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2012
Filed:
Mar. 28, 2008
Applicants:
Wen-chin Lee, Taoyuan, TW;
Cheng-hsien Lin, Taoyuan, TW;
Inventors:
Wen-Chin Lee, Taoyuan, TW;
Cheng-Hsien Lin, Taoyuan, TW;
Assignee:
Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.
Quick Actions:
Lee, Wen-Chin. (2012). Printed circuit board assembly (U.S. Patent No. 8089003). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8089003
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile