The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2012
Filed:
Jun. 01, 2005
Tomokazu Ito, Yokohama, JP;
Hisashi Nishigaki, Yokohama, JP;
Tsukasa Kawakami, Yokohama, JP;
Haruka Narita, Yokohama, JP;
Yoji Takizawa, Yokohama, JP;
Takumi Hanada, Yokohama, JP;
Munenori Iwami, Yokohama, JP;
Tomokazu Ito, Yokohama, JP;
Hisashi Nishigaki, Yokohama, JP;
Tsukasa Kawakami, Yokohama, JP;
Haruka Narita, Yokohama, JP;
Yoji Takizawa, Yokohama, JP;
Takumi Hanada, Yokohama, JP;
Munenori Iwami, Yokohama, JP;
Shibaura Mechatronics Corporation, Kanagawa, JP;
Abstract
A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer ALis formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer ALand hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer ALis formed on the first adhesive layer ALby rotating the substrate P at high speed. The first adhesive layer ALand the second adhesive layer ALare integrated to form a uniform adhesive layer B as a whole.