The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Sep. 25, 2007
Mitsuyoshi Hamada, Abiko, JP;
Akira Nagai, Hitachi, JP;
Hiroaki Ikeba, Oyama, JP;
Ken Nanaumi, Chikusei, JP;
Kouhei Yasuzawa, Chikusei, JP;
Mitsuyoshi Hamada, Abiko, JP;
Akira Nagai, Hitachi, JP;
Hiroaki Ikeba, Oyama, JP;
Ken Nanaumi, Chikusei, JP;
Kouhei Yasuzawa, Chikusei, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.