The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Mar. 26, 2008
Toru Yamada, Haibara-gun, JP;
Makoto Kikuchi, Haibara-gun, JP;
Tadashi Inaba, Haibara-gun, JP;
Takahiro Matsuno, Ashigarakami-gun, JP;
Takamitsu Tomiga, Haibara-gun, JP;
Kazutaka Takahashi, Haibara-gun, JP;
Toru Yamada, Haibara-gun, JP;
Makoto Kikuchi, Haibara-gun, JP;
Tadashi Inaba, Haibara-gun, JP;
Takahiro Matsuno, Ashigarakami-gun, JP;
Takamitsu Tomiga, Haibara-gun, JP;
Kazutaka Takahashi, Haibara-gun, JP;
Fujifilm Corporation, Tokyo, JP;
Abstract
A metal-polishing liquid used for chemical-mechanical polishing of a conductor film of copper or a copper alloy in a process for manufacturing a semiconductor device, the metal-polishing liquid comprising: (1) an amino acid derivative represented by the formula (I); and (2) a surfactant, wherein, in the formula (I), Rrepresents an alkyl group having 1 to 4 carbon atoms and Rrepresents an alkylene group having 1 to 4 carbon atoms.