The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2011
Filed:
Oct. 27, 2005
Applicants:
Tadashi Maeda, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Inventors:
Tadashi Maeda, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.