The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2011
Filed:
Jul. 08, 2009
Chun-hsien Lin, Hsin Chu, TW;
Andy Tsen, Chung-Ho, TW;
Jui-long Chen, Taichung, TW;
Sunny Wu, Zhudong Town, TW;
Jong-i Mou, Hsinpu Township, Hsinchu County, TW;
Chia-hung Huang, Hsinchu, TW;
Chun-Hsien Lin, Hsin Chu, TW;
Andy Tsen, Chung-Ho, TW;
Jui-Long Chen, Taichung, TW;
Sunny Wu, Zhudong Town, TW;
Jong-I Mou, Hsinpu Township, Hsinchu County, TW;
Chia-Hung Huang, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method for providing a bin ratio forecast at an early stage of integrated circuit device manufacturing processes is disclosed. The method comprises collecting historical data from one or more processed wafer lots; collect measurement data from one or more skew wafer lots; generating an estimated baseline distribution from the collected historical data and collected measurement data; generating an estimated performance distribution based on one or more specified parameters and the generated estimated baseline distribution; determining a bin ratio forecast by applying a bin definition and a yield degradation factor estimation to the generated estimated performance distribution; determining one or more production targets based on the bin ratio forecast; and processing one or more wafers based on the one or more determined production targets.