The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2011
Filed:
Sep. 14, 2007
Jeremy Werner, San Jose, CA (US);
Daniel L. Rosenband, San Mateo, CA (US);
Jeremy Matthew Plunkett, San Jose, CA (US);
William L. Schmidt, Los Gatos, CA (US);
David T. Wang, San Jose, CA (US);
Wael O. Zohni, San Jose, CA (US);
Philip Arnold Ferolito, Sunnyvale, CA (US);
Michael John Sebastian Smith, Palo Alto, CA (US);
Suresh Natarajan Rajan, San Jose, CA (US);
Joseph C. Fjelstad, Sunnyvale, CA (US);
Jeremy Werner, San Jose, CA (US);
Daniel L. Rosenband, San Mateo, CA (US);
Jeremy Matthew Plunkett, San Jose, CA (US);
William L. Schmidt, Los Gatos, CA (US);
David T. Wang, San Jose, CA (US);
Wael O. Zohni, San Jose, CA (US);
Philip Arnold Ferolito, Sunnyvale, CA (US);
Michael John Sebastian Smith, Palo Alto, CA (US);
Suresh Natarajan Rajan, San Jose, CA (US);
Joseph C. Fjelstad, Sunnyvale, CA (US);
Google Inc., Mountain View, CA (US);
Abstract
A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.