The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
May. 22, 2009
Seiya Fujii, Tokyo, JP;
Seiya Fujii, Tokyo, JP;
Elpida Memory, Inc, Tokyo, JP;
Abstract
A semiconductor device includes at least a wiring board, a semiconductor chip that is mounted on one face side of the wiring board, connection pads that are formed on the one face side of the wiring board, and connect through bonding wires to electrode pads on the semiconductor chip, and bumps disposed on another face side of the wiring board; the semiconductor chip is disposed such that four chip sides face corners of the wiring board, and each chip corner is near one of the outer peripheral sides of the wiring board; and, on one face of the wiring board are provided corner regions which are enclosed by the chip sides of the semiconductor chip and the corners of the wiring board, and the connection pads are disposed in these corner regions.