The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2011

Filed:

Mar. 04, 2009
Applicants:

Gloria Lin, San Ramon, CA (US);

Wyeman Chen, Hayward, CA (US);

Michael Nikkhoo, Saratoga, CA (US);

Michael Rosenblatt, Campbell, CA (US);

Hammid Mohammadinia, San Jose, CA (US);

Ziv Wolkowicki, Valley Stream, NY (US);

Amir Salehi, San Jose, CA (US);

Inventors:

Gloria Lin, San Ramon, CA (US);

Wyeman Chen, Hayward, CA (US);

Michael Nikkhoo, Saratoga, CA (US);

Michael Rosenblatt, Campbell, CA (US);

Hammid Mohammadinia, San Jose, CA (US);

Ziv Wolkowicki, Valley Stream, NY (US);

Amir Salehi, San Jose, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.


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