The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Aug. 10, 2010
Noriyoshi Shimizu, Kawasaki, JP;
Nobuyuki Ohtsuka, Kawasaki, JP;
Hideki Kitada, Kawasaki, JP;
Yoshiyuki Nakao, Kawasaki, JP;
Noriyoshi Shimizu, Kawasaki, JP;
Nobuyuki Ohtsuka, Kawasaki, JP;
Hideki Kitada, Kawasaki, JP;
Yoshiyuki Nakao, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
(a1) A concave portion is formed in an interlayer insulating film formed on a semiconductor substrate. (a2) A first film of Mn is formed by CVD, the first film covering the inner surface of the concave portion and the upper surface of the insulating film. (a3) Conductive material essentially consisting of Cu is deposited on the first film to embed the conductive material in the concave portion. (a4) The semiconductor substrate is annealed. During the period until a barrier layer is formed having also a function of improving tight adhesion, it is possible to ensure sufficient tight adhesion of wiring members and prevent peel-off of the wiring members.