The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Apr. 21, 2010
Seiichi Nakatani, Osaka, JP;
Takashi Kitae, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Takashi Ichiryu, Osaka, JP;
Seiji Karashima, Osaka, JP;
Seiichi Nakatani, Osaka, JP;
Takashi Kitae, Osaka, JP;
Yoshihisa Yamashita, Kyoto, JP;
Takashi Ichiryu, Osaka, JP;
Seiji Karashima, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The flip chip mounted body of the present invention includes: a circuit board () having a plurality of connection terminals (); a semiconductor chip () having a plurality of electrode terminals () that are disposed opposing the connection terminals (); and a porous sheet () having a box shape that is provided on an opposite side of a formation surface of the electrode terminal () of the semiconductor chip (), is folded on an outer periphery of the semiconductor chip () on the formation surface side of the electrode terminal () and is in contact with the circuit board (), wherein the connection terminal () of the circuit board () and the electrode terminal () of the semiconductor chip () are connected electrically via a solder layer (), and the circuit board () and the semiconductor chip () are fixed by a resin (). Thereby, the flip chip mounted body with excellent productivity and reliability that can mount the semiconductor chip on the circuit board, and a method and an apparatus for mounting the flip chip mounted body are provided.