The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2011
Filed:
Jul. 06, 2010
Applicants:
Belgacem Haba, Saratoga, CA (US);
Craig S. Mitchell, San Jose, CA (US);
Apolinar Alvarez, Jr., Fremont, CA (US);
Inventors:
Belgacem Haba, Saratoga, CA (US);
Craig S. Mitchell, San Jose, CA (US);
Apolinar Alvarez, Jr., Fremont, CA (US);
Assignee:
Tessera, Inc., San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
Abstract
Substrates having molded dielectric layers and methods of fabricating such substrates are disclosed. The substrates may advantageously be used in microelectronic assemblies having high routing density.
Haba, Belgacem. (2011). Substrate for a microelectronic package and method of fabricating thereof (U.S. Patent No. 8071424). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8071424
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile