The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 2011
Filed:
Feb. 03, 2009
Jonghae Kim, Fishkill, NY (US);
Shiqun Gu, San Diego, CA (US);
Brian Matthew Henderson, Escondido, CA (US);
Thomas R. Toms, Dripping Springs, TX (US);
Matthew Nowak, San Diego, CA (US);
Jonghae Kim, Fishkill, NY (US);
Shiqun Gu, San Diego, CA (US);
Brian Matthew Henderson, Escondido, CA (US);
Thomas R. Toms, Dripping Springs, TX (US);
Matthew Nowak, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A semiconductor die includes a semiconductive substrate layer with first and second sides, a metal layer adjacent the second side of the semiconductive substrate layer, one or more active devices in an active layer on the first side of the semiconductive substrate layer; and a passive device in the metal layer in electrical communication with the active layer. The passive device can electrically couple to the active layer with through silicon vias (TSVs).