The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Jan. 27, 2005
Toshiyuki Asahi, Hirakata, JP;
Seiji Karashima, Hirakata, JP;
Takashi Ichiryu, Moriguchi, JP;
Seiichi Nakatani, Hirakata, JP;
Tousaku Nishiyama, Nara, JP;
Toshiyuki Asahi, Hirakata, JP;
Seiji Karashima, Hirakata, JP;
Takashi Ichiryu, Moriguchi, JP;
Seiichi Nakatani, Hirakata, JP;
Tousaku Nishiyama, Nara, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A module with a built-in component is provided which can be produced without a via-forming step. The module with a built-in componentincludes an insulating sheet substratewhich has an upper surface, a lower surfaceopposed to the upper surfaceand a side surfacewhich connects these surfaces. At least one wiringextends from the upper surface to the lower surface through the side surface, and an electronic componentis disposed within the sheet substrate.