The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2011
Filed:
Jun. 30, 2009
Applicants:
Po-hsuan Kuo, Taipei Hsien, TW;
Chih-hsun Lin, Taipei Hsien, TW;
Inventors:
Po-Hsuan Kuo, Taipei Hsien, TW;
Chih-Hsun Lin, Taipei Hsien, TW;
Assignee:
Foxconn Technology Co., Ltd., Tu-Cheng, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01); A44B 11/25 (2006.01);
U.S. Cl.
CPC ...
Abstract
A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three resilient members secured on a bottom surface thereof. Each of the resilient members has a capability to deform resiliently along a direction perpendicular to the bottom surface of the securing plate to resiliently press the heat spreader to an electronic component.