Apparatus and methods for testing microelectronic devices

Abstract

Microelectronic devices, methods for testing microelectronic devices, and detachable electrical components. One embodiment of an apparatus for testing microelectronic devices in accordance with the invention comprises a board having a primary side, a secondary side, a plurality of test sites at the primary side, and electrical lines electrically coupled to the test sites. The testing apparatus can further include a plurality of lead holes in the board. Individual lead holes have a sidewall and a conductive section plated onto the sidewall. In several embodiments, individual pairs of first and second lead holes are electrically coupled to electrical lines corresponding to an associated test site. The apparatus can further include a plurality of permanent fuses fixed to the board. Individual permanent fuses are electrically coupled to electrical lines associated with an individual test site and an individual pair of first and second lead holes. The testing apparatus can further include a replacement fuse mounted to an individual pair of first and second lead holes at a test site having a blown permanent fuse. The replacement fuse has a first lead with a press-fit member engaged directly with the plated section in the first lead hole. The replacement fuse further includes a second lead engaged with the second lead hole and a fuse element connected in series with the first and second leads.