The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8063486 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 22, 2011

Filed:

May. 14, 2007
Applicants:

Koichi Hirano, Osaka, JP;

Tsukasa Shiraishi, Osaka, JP;

Seiichi Nakatani, Osaka, JP;

Tatsuo Ogawa, Osaka, JP;

Inventors:

Koichi Hirano, Osaka, JP;

Tsukasa Shiraishi, Osaka, JP;

Seiichi Nakatani, Osaka, JP;

Tatsuo Ogawa, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit boardhaving a base materialand an electrodeformed on at least one main surface of the base materialincludes an easy peeling portionformed in at least one of an inner portion and a side portion of the electrode, with the adhesive strength between the electrodeand the easy peeling portionbeing less than the adhesive strength between the electrodeand the base material. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.


Find Patent Forward Citations

Hirano, Koichi. (2011). Circuit board, method for manufacturing the same, and semiconductor device (U.S. Patent No. 8063486). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8063486

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