The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2011

Filed:

Nov. 13, 2008
Applicants:

YE Feng, Santa Clara, CA (US);

Zhuan Liu, Fremont, CA (US);

Inventors:

Ye Feng, Santa Clara, CA (US);

Zhuan Liu, Fremont, CA (US);

Assignee:

Nanometrics Incorporated, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sample that is processed to remove a top layer, e.g., using chemical mechanical polishing or etching, is accurately measured using multiple models of the sample. The multiple models may be constrained based on a pre-processing measurement of the sample. By way of example, the multiple models of the sample may be linked in pairs, where one pair includes a model simulating the pre-processed sample and another model simulating the post-processed sample with a portion of the top layer remaining, i.e., under-processing. Another pair of linked models includes a model simulating the pre-processed sample and a model simulating the post-processing sample with the top layer removed, i.e., the correct amount of processing or over-processing. The underlying layers in the linked model pairs are constrained to have the same parameters. The modeling process may use a non-linear regression or libraries.


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