The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8058142 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 15, 2011

Filed:

May. 21, 2009
Applicant:

Sang-yun Lee, Beaverton, OR (US);

Inventor:

Sang-Yun Lee, Beaverton, OR (US);

Assignee:

BeSang Inc., Beaverton, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A bonded semiconductor structure static random access memory circuit includes a support substrate which carries a first horizontally oriented transistor, and an interconnect region which includes a conductive line. The memory circuit includes a donor substrate which includes a semiconductor layer stack coupled to a donor substrate body region through a detach region, wherein the semiconductor layer stack is coupled to the interconnect region through a bonding interface, and wherein the semiconductor layer stack includes a pn junction.


Find Patent Forward Citations

Lee, Sang-Yun. (2011). Bonded semiconductor structure and method of making the same (U.S. Patent No. 8058142). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8058142

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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