The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2011
Filed:
Sep. 29, 2010
Duraiswamy Srinivasan, Bangalore, IN;
Reed Roeder Corderman, New York, NY (US);
Christopher Fred Keimel, Schenectady, NY (US);
Somasundaram Gunasekaran, Bangalore, IN;
Sudhakar Eddula Reddy, Bangalore, IN;
Arun Virupaksha Gowda, Rexford, NY (US);
Kanakasabapathi Subramanian, Chennai, IN;
OM Prakash, Bangalore, IN;
Duraiswamy Srinivasan, Bangalore, IN;
Reed Roeder Corderman, New York, NY (US);
Christopher Fred Keimel, Schenectady, NY (US);
Somasundaram Gunasekaran, Bangalore, IN;
Sudhakar Eddula Reddy, Bangalore, IN;
Arun Virupaksha Gowda, Rexford, NY (US);
Kanakasabapathi Subramanian, Chennai, IN;
Om Prakash, Bangalore, IN;
General Electric Company, Niskayuna, NY (US);
Abstract
A device for controlling the flow of electric current is provided. The device comprises a first conductor as thin film form; a second conductor switchably coupled to the first conductor to alternate between an electrically connected state with the first conductor and an electrically disconnected state with the first conductor. At least one conductor further comprises an electrical contact, the electrical contact comprising a solid matrix comprising a plurality of pores; and a filler material disposed within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575 K. A method to make an electrical contact is provided. The method includes the steps of: providing a substrate; providing a plurality of pores on the substrate; and disposing a filler material within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575 K.