The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2011

Filed:

Jun. 17, 2009
Applicants:

Dong Ha Jung, Gyeonggi-do, KR;

Seung Jin Yeom, Gyeonggi-do, KR;

Baek Mann Kim, Gyeonggi-do, KR;

Nam Yeal Lee, Gyeonggi-do, KR;

Inventors:

Dong Ha Jung, Gyeonggi-do, KR;

Seung Jin Yeom, Gyeonggi-do, KR;

Baek Mann Kim, Gyeonggi-do, KR;

Nam Yeal Lee, Gyeonggi-do, KR;

Assignee:

Hynix Semiconductor Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A metal line of a semiconductor device includes an insulation layer formed on a semiconductor substrate. The insulation layer has a metal line forming region. A diffusion barrier is formed on a surface of the metal line forming region of the insulation layer. The diffusion barrier includes a multi-layered structure that includes an MoBlayer, an MoBNlayer and an Mo layer. A metal layer is formed on the diffusion barrier to fill the metal line forming region of the insulation layer.


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