The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2011

Filed:

Nov. 03, 2008
Applicants:

Pei-wen Luo, Kaohsiung County, TW;

Jwu-e Chen, Hsinchu, TW;

Chin-long Wey, Kaohsiung, TW;

Liang-chia Cheng, Tainan County, TW;

Ji-jan Chen, Kaohsiung, TW;

Wen-ching Wu, Hsinchu County, TW;

Inventors:

Pei-Wen Luo, Kaohsiung County, TW;

Jwu-E Chen, Hsinchu, TW;

Chin-Long Wey, Kaohsiung, TW;

Liang-Chia Cheng, Tainan County, TW;

Ji-Jan Chen, Kaohsiung, TW;

Wen-Ching Wu, Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 9/455 (2006.01); G06F 11/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A yield evaluating apparatus and a method thereof are provided. The yield evaluating apparatus includes a spatial correlation module. The spatial correlation module receives at least one process-related data and a plurality of circuit layouts and obtains a correlation coefficient between unit elements in the circuit layouts according to the process-related data. The spatial correlation module calculates a spatial correlation between elements in each of the circuit layouts according to the correlation coefficient and selects one of the circuit layouts according to the spatial correlations.


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