The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Nov. 23, 2005
Applicants:
Ra-min Tain, Chung-Ho, TW;
Wei-chung Lo, Zhonghe, TW;
Li-cheng Shen, Hsin-Chu, TW;
Inventors:
Assignee:
Industrial Technology Research Institute, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
Abstract
A structure of light emitting diode (LED) wafer-level chip scale packaging (WL-CSP) is disclosed. The process of making the same is also provided in this invention. The LED CSP utilizes the through hole metal filling to enhance heat conduction between the LED die and its carrier substrate. The CSP structure is achieved by bonding pre-processed through-hole-filling carrier substrate against the flip-chip LED wafer.