The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2011
Filed:
Jul. 26, 2007
Chun-fu Chen, Taipei, TW;
Yung-tai Hung, Chiayi, TW;
Chin-ta Su, Yunlin, TW;
Kuang-chao Chen, Taipei, TW;
Chun-Fu Chen, Taipei, TW;
Yung-Tai Hung, Chiayi, TW;
Chin-Ta Su, Yunlin, TW;
Kuang-Chao Chen, Taipei, TW;
Macronix International Co., Ltd., Hsinchu, TW;
Abstract
A method for chemical-mechanical polishing two adjacent structures of a semiconductor device is provided. The method for mechanical polishing comprising: (a) providing a semiconductor device comprising a recess formed in a surface thereof, a first layer formed over the surface, and a second layer filled with the recess and formed on the first layer; and (b) substantially polishing the first and second layer with a pad and a substantially inhibitor-free slurry, wherein the pad comprising a corrosion inhibitor of the second layer.